2011:

New investments made in Drilling machines, multilayer press and electrical testers.

New equipment will substantially improve express production of multilayer and HDI boards.

2010:

Copper micro via filling is offered for HDI circuit boards designs.

The process is according to standard IPC - 4761.

2009:

Micromachining laser drill

Hi Tech Corporation has installed the second ESI state-of-the-art Micromachining laser drill.

With this investment Hi-Tech Corporation dramatically increased production throughput of high technology PCBs.

2008:

UL File E174311 has been enlarged, recently, with New Types Printed Wiring Boards

We are glad to annouce that our UL File E174311 has been enlarged, recently, with New Types Printed Wiring Boards of Multilayer construction 02SAS, 03SAS and 04SAS. This includes HDI PWB characteristics and enlarged list of Base Materials (Mfr & Grade).

Please find all necessary information in the below links.

We trust you will find this information helpful for more confindence in Hi Tech's Production capabilities.

ISO 27001:2005 ISMS (Information Security Management System) was implemented.

ISO 27001:2005 ISMS (Information Security Management System) was implemented in Hi Tech Corporation.Under guidelines of T&P Consulting and co-finance of World Bank branch IFC in Skopje project team finished a tremendous job in 6 months.

""Our future depends on the security of the information we use""

INFORMATION SECURITY POLICY

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