High density (HDI) printed circuit boards
HDI multilayer board production is the core of our business.
The recent miniaturization of electronic equipments, such as mobile phones demands ever smaller via holes. Hi-Tech Corp. offers laser via holes PCB using glass epoxy resin (FR-4) and variety of stack-ups.
This production technology combines sequential lamination and build-up structure
• Sequential lamination is used to make high-performance, multi-layer PCBs for mounting high pin packages
• Build-up structure is used to make high-density PCBs for mounting fine pin pitch packages closely together
Advantages
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• High-speed • High-density • Design flexibility • Layer reduction • Compatible with UL 94V0 or equivalent • Allows for smaller via holes • Suitable for halogen-free products • Helps make product light and thin |
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Technology/Micro via Technology/Materials
News
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New investments made in Drilling machines, multilayer press and electrical testers.
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Copper micro via filling is offered for HDI circuit boards designs.
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Hi Tech Corporation has installed the second ESI state-of-the-art Micromachining laser drill...
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UL File E174311 has been enlarged, recently, with New Types Printed Wiring Boards...
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ISO 27001:2005 ISMS (Information Security Management System) was implemented in Hi Tech Corporation...
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