Rigid printed circuit boards capability
(Other specific requirements are possible on customer request)
Maximum layers |
36 |
Sequential Lamination |
multiple cycles |
Base material
Standard Tg |
High Tg |
|
FR4 ’Panasonic’ |
130- 150 °C |
170 °C |
FR4 ’ITEQ’ |
130- 150 °C |
170 °C |
FR4 ’Hitachi’ |
130- 150 °C |
170 °C |
FR4 Halogen Free |
150 °C |
|
’Rogers’ 4000 series |
210 °C |
|
Polyimide Arlon 35N |
210 °C |
Board size
|
485x585mm Max.Finished Board size |
(SS/DS;FR4,PTH) |
| 458x550mm Max.Finished Board size |
(ML6 >,FR4,PTH) |
| 510x635mm Max.Finished Board size |
(ML,FR4,PTH) |
PCB Thickness
|
DS /ML |
0.4; 0.5; 0.8; 1.0; 1.5; 1.6; 2.0; 2.4; 3.0; 3.2; 5.0 (mm) |
| Min. IL thickness |
0.050 mm |
Finished Copper thickness
|
Finish (galvanic/ plating) |
| 35 (55); 70; 105; 140; 210; 235; 435 microns |
Minimum trace/gap
|
>= 35 up to 125 microns |
Via/ Hole Sizes
|
Min.Hole Size Drilled |
Min.Hole Size Plated |
Aspect Ratio |
|
|
PTH |
0.15 mm |
0.1 mm |
1:25 |
|
Buried via /hole |
0.1 mm |
1:25 |
|
|
Blind via |
0.1 mm |
0.05 mm |
1:25 |
|
Laser vias |
0.075 mm |
0.025 mm |
|
|
Depth drilling |
+/- 10 microns |
||
|
Standard Drilled Hole to Copper Feature: 0.2 mm min. |
|||
|
Drill Position: Tolerance of +/- 0.35mm |
|||
Micro via Spec
|
Filled (and capped vias) |
with Non-conductive paste |
| Plugged |
with solder mask or via filler SD-2361 “Peters” |
| See IPC- 4761 for further types and details |
|
Surface finish
|
Standard |
Special |
|
|
HASL Pb |
||
|
HASL Lead Free |
2.5 – 25.0 um Sn |
|
|
Chemical Nickel/Gold (ENIG) |
0.1 microns Au/3-6 microns Ni |
1.0 microns Au/3-6 microns Ni |
|
Hard Gold |
0.8 microns Au/3-6 microns Ni |
1.5-2.0 microns Au/3-6 microns Ni |
|
Chemical Tin |
0.8 – 1.0 um Sn |
|
|
Plating thickness galvanic copper |
25.0 microns |
|
|
Plating thickness galvanic Sn |
7.0 microns |
|
|
Plating thickness electrolytic Ni |
5.0 microns |
|
|
Plating thickness electrolytic Au |
2.0 microns |
|
|
Sn/Pb thickness HASL |
2.0-25.0 microns |
|
|
Plating thickness immersion Ni |
5.0 microns |
|
|
Plating thickness immersion Au |
0.1 microns |
|
|
Plating thickness immersion Sn |
1.0 micron |
|
Soldermask
|
Colors: |
Type: |
Manufacturer: |
|
|
Photoimagable |
green,red, blue |
semi-matt |
“Sun chemicals” |
|
black |
semi-matt |
“Tayio” |
|
|
white |
glossy |
“Peters” |
|
|
Marking ink |
white, black, yellow |
AGFA ink; |
|
|
Peters SD-2593UV |
|||
|
Peelable |
(Blue) mask (max. hole fill 3mm) |
Peters SD-2955 |
|
|
Photo definable soldermask thickness: 20-30 µm (microns) |
|||
|
Solder Mask Bridge: 70 µm (microns) |
|||
|
Solder Mask Opening (Pad): 150 µm (microns) |
|||
Electrical test
|
Max. testing area |
600 x 660mm |
|
Testing voltage |
500V HV test |
|
Number of measuring points |
Unlimited |
|
Minimal grid of testing points |
50 µm (microns) +/- |
AOI
|
Max. inspection area |
500 x 600mm |
|
Min. detectable defect size |
0.035 mm +/- |
Tests
|
Solderability test |
Yes |
|
Adhesion of the soldermask test |
Yes |
|
Adhesion of the plating test |
Yes |
|
Stress test |
Yes |
|
Temperature-humidity test |
Yes |
|
Impedance protocol |
Yes |
|
Microsectioning photo |
Yes |
|
Plating thickness protocol (Sn,Au,Ni,Cu) |
Yes |
Tolerances
|
Copper pattern accuracy |
5 µm (microns) |
|
Solder resists to pattern pad acc.) |
30 µm (microns |
|
Finished board thickness |
+/- 10% |
|
Diameter NPTH ( finished holes) |
+ / - 50 µm (microns) |
|
Diameter PTH ( finished holes) |
+/ - 50 µm (microns) |
|
Hole position accuracy |
+/- 20 µm (microns) |
|
Depth drilling |
10 µm (microns) |
|
Finished board size |
+/- 100 µm (microns)> |
|
Plating thickness galvanic copper |
+/- 10 µm (microns)> |
|
Plating thickness galvanic SN |
/ - 5 µm (microns)> |
|
Plating thickness chemical NiAu |
+/ - 0.10 µm (microns)> |
|
Plating thickness electrolytical NiAu |
+/- 0.1 µm (microns)> |
|
Track width external layers |
+ / 20 %> |
|
Track width internal layers |
+ / 20 %> |
|
Spacing external layers |
+ / 20 %> |
|
Spacing internal layers |
+ / 20 % |
|
Controlled impedance tolerances |
+/- 5% and +/- 10% |
Other features
|
Impendance controlled PCB's |
+/- 5 or 10 % |
|
Layer to Layer registration |
+/-25 µm (microns) |
|
Min. PTH to copper |
+/- 150 µm (microns) |
News
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New investments made in Drilling machines, multilayer press and electrical testers.
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Copper micro via filling is offered for HDI circuit boards designs.
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Hi Tech Corporation has installed the second ESI state-of-the-art Micromachining laser drill...
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UL File E174311 has been enlarged, recently, with New Types Printed Wiring Boards...
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ISO 27001:2005 ISMS (Information Security Management System) was implemented in Hi Tech Corporation...
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