Rigid printed circuit boards capability

(Other specific requirements are possible on customer request)

Maximum layers

36

Sequential Lamination

multiple cycles

Base material

Standard Tg

High Tg

FR4 ’Panasonic’

130- 150 °C

170 °C

FR4 ’ITEQ’

130- 150 °C

170 °C

FR4 ’Hitachi’

130- 150 °C

170 °C

FR4 Halogen Free

150 °C

’Rogers’ 4000 series

210 °C

Polyimide Arlon 35N

210 °C

Board size

485x585mm    Max.Finished Board size

(SS/DS;FR4,PTH)

458x550mm    Max.Finished Board size

(ML6 >,FR4,PTH)

510x635mm    Max.Finished Board size

(ML,FR4,PTH)

PCB Thickness

DS /ML

0.4; 0.5; 0.8; 1.0; 1.5; 1.6; 2.0; 2.4; 3.0; 3.2; 5.0 (mm)

Min. IL thickness

0.050 mm

Finished Copper thickness

Finish (galvanic/ plating)

35 (55); 70; 105; 140; 210; 235; 435 microns

Minimum trace/gap

>= 35 up to 125 microns

Via/ Hole Sizes

Min.Hole Size Drilled

Min.Hole Size Plated

Aspect Ratio

PTH

0.15 mm

0.1 mm

1:25

Buried via /hole

0.1 mm

1:25

Blind via

0.1 mm

0.05 mm

1:25

Laser vias

0.075 mm

0.025 mm

Depth drilling

+/- 10 microns

Standard Drilled Hole to Copper Feature: 0.2 mm min.

Drill Position: Tolerance of +/- 0.35mm

Micro via Spec

Filled (and capped vias)

with Non-conductive paste
with copper

Plugged

with solder mask or via filler SD-2361 “Peters”

See IPC- 4761 for further types and details

Surface finish

Standard

Special

HASL Pb

HASL Lead Free

2.5 – 25.0 um Sn

Chemical Nickel/Gold (ENIG)

0.1 microns Au/3-6 microns Ni

1.0 microns Au/3-6 microns Ni

Hard Gold

0.8-1.2 microns Au/3-6 microns Ni

Chemical Tin

0.8 – 1.0 um Sn

Plating thickness galvanic copper

25.0 microns

Plating thickness galvanic Sn

7.0 microns

Plating thickness electrolytic Ni

5.0 microns

Plating thickness electrolytic Au

2.0 microns

Sn/Pb thickness HASL

2.0-25.0 microns

Plating thickness immersion Ni

5.0 microns

Plating thickness immersion Au

0.1 microns

Plating thickness immersion Sn

1.0 micron

Soldermask

Colors:

Type:

Manufacturer:

Photoimagable

green,red, blue

semi-matt

“Sun chemicals”

black

semi-matt

“Tayio”

white

glossy

“Peters”

Marking ink

white, black, yellow

AGFA ink;

Peters SD-2593UV

Peelable

(Blue) mask (max. hole fill 3mm)

Peters SD-2955

Photo definable soldermask thickness: 20-30 µm (microns)

Solder Mask Bridge: 70 µm (microns)

Solder Mask Opening (Pad): 150 µm (microns)

Electrical test

Max. testing area

600 x 660mm

Testing voltage

500V HV test

Number of measuring points

Unlimited

Minimal grid of testing points

50 µm (microns) +/-

AOI

Max. inspection area

500 x 600mm

Min. detectable defect size

0.035 mm +/-

Tests

Solderability test

Yes

Adhesion of the soldermask test

Yes

Adhesion of the plating test

Yes

Stress test

Yes

Temperature-humidity test

Yes

Impedance protocol

Yes

Microsectioning photo

Yes

Plating thickness protocol (Sn,Au,Ni,Cu)

Yes

Tolerances

Copper pattern accuracy

5 µm (microns)

Solder resists to pattern pad acc.)

30 µm (microns

Finished board thickness

+/- 10%

Diameter NPTH ( finished holes)

+ / - 50 µm (microns)

Diameter PTH ( finished holes)

+/ - 50 µm (microns)

Hole position accuracy

+/- 20 µm (microns)

Depth drilling

10 µm (microns)

Finished board size

+/- 100 µm (microns)>

Plating thickness galvanic copper

+/- 10 µm (microns)>

Plating thickness galvanic SN

/ - 5 µm (microns)>

Plating thickness chemical NiAu

+/ - 0.10 µm (microns)>

Plating thickness electrolytical NiAu

+/- 0.1 µm (microns)>

Track width external layers

+ / 20 %>

Track width internal layers

+ / 20 %>

Spacing external layers

+ / 20 %>

Spacing internal layers

+ / 20 %

Controlled impedance tolerances

+/- 5% and +/- 10%

Other features

Impendance controlled PCB's

+/- 5 or 10 %

Layer to Layer registration

+/-25 µm (microns)

Min. PTH to copper

+/- 150 µm (microns)



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