Thick Copper Boards technology
“Thick Copper Board” is defined as any circuit with a copper weight over 140 microns of copper deposit.
“PowerLink” is defined as the use of 2 or more copper weights on the same external layer of a printed wiring board.
Board Layout and Stack-up
• Balanced circuit density minimizes uneven plating and prevents poor lamination (de-lamination)
• Symmetrical construction: PCB designer can influence the warping possibility by choosing a suitable circuit board build-up. In order to achieve the best result, the build-up must be symmetrical around the centre plane of the circuit board. Asymmetrical build-ups cause warp due to differences in the CTE (Coefficient of Thermal Expansion), which cause internal stress when heating and cooling the circuit board.
• Thick copper conductors can significantly increase the overall board thickness
• Designs using “Power Link” will have an overall thickness defined by the thickest copper used
• Designs using “Power Link” required 1 drill per copper weight
• NPT holes are not affected by thick copper or “Power Link”
• Conductor lands and pads must be sized to accommodate the thick copper plating
• A baseline method of sizing conductors is based on current, temperature rise and cross-sectional area
• Optimizing the size of any conductor requires an understanding of the flow of electrical current and the resulting power dissipation
• Some variables for thermal management:
º Environment ( exposed to air, space, another gas)
º Board material properties such as: thermal conductivity, material density, fluid velocities and viscosities, thickness between layers /planes
º Number of copper planes and their thickness
º Number of plated vias, their diameter and copper weight
º Heat sources other than trace power loss
Copper weights
Cu FOIL THICKNESS AND LINE/SPACE
Outlayers
|
Cu thickness |
Min.line width (nominal) |
Min. spacing (nominal) |
|
| Base foil |
Finish(galvanic) |
||
| 9 µm |
35 µm |
50 µm |
50 µm |
| 12 µm |
45-50 µm |
75 µm |
75 µm |
| 18 µm |
50-55 µm |
100 µm |
100 µm |
| 35 µm |
70 µm |
150 µm |
150 µm |
| 70 µm |
105 µm |
250 µm |
250 µm |
| 105 µm |
140 µm |
300 µm |
350 µm |
| 140 µm |
200 µm |
400 µm |
400 µm |
| 210 µm |
235 µm |
500 µm |
500 µm |
| 400 µm |
435 µm |
900 µm |
900 µm |
Innerlayers
|
Cu foil |
Min. line width |
Min. spacing |
|
9 µm |
50 µm |
50 µm |
|
12 µm |
75 µm |
75 µm |
|
18 µm |
100 µm |
100 µm |
|
35 µm |
125 µm |
125 µm |
|
70 µm |
200 µm |
200 µm |
|
105 µm |
250 µm |
250 µm |
|
140 µm |
300 µm |
350 µm |
|
210 µm |
500 µm |
500 µm |
|
400 µm |
900 µm |
900 µm |
News
-
-
New investments made in Drilling machines, multilayer press and electrical testers.
-
-
-
Copper micro via filling is offered for HDI circuit boards designs.
-
-
-
Hi Tech Corporation has installed the second ESI state-of-the-art Micromachining laser drill...
-
-
-
UL File E174311 has been enlarged, recently, with New Types Printed Wiring Boards...
-
-
-
ISO 27001:2005 ISMS (Information Security Management System) was implemented in Hi Tech Corporation...
-
Log In
Quick links
Newsletter
You can enter your e-mail address if you want to get newsletter of our company
